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Lead architecture and development of low-level embedded firmware for mixed-signal and digital SoCs, ensuring first-silicon success and robust firmware foundations.

Lead the development of SoCs for satellites, manage physical design partners, ensure timing closure, and support design integration.

The engineer will define and implement ASIC package architecture, focusing on FC-BGA and MCM solutions, collaborating on package design and ensuring successful production of high-performance ASICs.

The role involves leading ASIC package design for FC-BGA and MCM solutions, ensuring high-performance mixed-signal/digital SoCs succeed from architecture to production. Responsibilities include trade studies, design standards, and vendor collaboration.