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Nokia

Sr Principal TIA Designer

Posted 2 Months Ago
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Remote or Hybrid
Hiring Remotely in United States
Senior level
Remote or Hybrid
Hiring Remotely in United States
Senior level
Lead architecture, transistor-level design, simulation, verification, silicon bring-up, and characterization of ultra-high-speed TIAs and supporting analog functions (AGC, CTLE, regulators) using SiGe BiCMOS/CMOS. Drive package/system integration, mentor junior designers, collaborate across layout, DSP, packaging, and product teams, and ensure successful first-pass silicon.
The summary above was generated by AI

Join Nokia's advanced photonics and semiconductor design team, developing next-generation analog ICs for high-speed optical communication systems. In this role, you will lead the design of multi-tens of GHz Transimpedance Amplifiers (TIAs) for coherent long-haul, metro, and PAM4 data center applications, leveraging cutting-edge SiGe BiCMOS and CMOS technologies. You'll play a key role in delivering innovative solutions that enable faster, more efficient data transmission across data centers, telecommunications networks, and emerging AI-driven infrastructure.


NION2026

Responsibilities
  • Lead the architecture, design, simulation, verification, and silicon bring-up of ultra-high-speed Transimpedance Amplifiers (TIAs) for coherent optical and PAM4 data center applications. 

  • Translate system and chip-level requirements into robust analog circuit architectures and detailed transistor-level designs. 

  • Design and optimize low-noise, high-linearity broadband analog circuits for optical receiver front ends. 

  • Develop and validate supporting analog functions, including AGC loops, CTLEs, voltage regulators, bandgaps, and data converter interfaces. 

  • Drive package and system-level integration, ensuring optimal signal integrity and performance. 

  • Perform silicon characterization, debug, and correlation of measurement results against simulation models. 

  • Collaborate closely with layout, system, DSP, packaging, and product engineering teams throughout the development cycle. 

  • Lead technical reviews, contribute to design methodology improvements, and ensure successful first-pass silicon execution. 

  • Mentor and guide junior analog designers, fostering technical excellence within the team. 

  • Create and maintain high-quality technical documentation, design reports, and specifications.

Qualifications
  • Extensive experience designing high-speed TIAs for coherent optical communication systems and/or PAM4 data center transceivers. 
  • Strong expertise in analog and mixed-signal IC design using SiGe BiCMOS and CMOS technologies. 
  • Deep understanding of transistor-level circuit design, device physics, noise analysis, and feedback/control loop stability. 
  • Proven experience in one or more of the following areas: 
    • Optical receiver front-end design
    • AGC loop implementation
    • CTLE design
    • High-precision analog circuits (bandgaps, regulators, ADC/DAC interfaces)
    • Package and system-level integration
  • Proficiency with industry-standard EDA tools, custom analog layout techniques, and electromagnetic (EM) simulation tools. 
  • Demonstrated success delivering silicon from concept through production. 
  • Hands-on experience with lab measurement, debugging, and performance validation of high-speed ICs. 
  • Strong leadership, problem-solving, communication, and collaboration skills. 
  • Ability to work effectively in a fast-paced, multidisciplinary global engineering environment.

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