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Nokia

Sr. Principal PIC Development Engineer

Posted Yesterday
Be an Early Applicant
Remote or Hybrid
2 Locations
Senior level
Remote or Hybrid
2 Locations
Senior level
The role involves managing the design and development of photonic integrated circuits, overseeing team performance, project budgets, and cross-functional collaboration in telecommunications and optoelectronics.
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The Sr Principal PIC Development Engineer will oversee the design, development, and transfer to manufacturing of Infinera’s Photonic Integrated Circuits (PIC) products. The person should be detail orientated and able to manage multiple critical path activities at the same time. He or she should have significant experience with Photonic devices, especially for InP based devices and be familiar with device fabrication and manufacturing. The successful candidate will be expected to work cross-functionally with optoelectronic packaging, assembly and Analog ASIC design teams and  be able to technically communicate with team members and up-level key messages/requirements.  The person should be able to develop and manage risk assessments over project lifecycles.  He or she must be able to develop and manage project budgets and schedules.

Responsibilities
  • Manage and scale the team to deliver solutions in support of Infinera’s development of optical engine
  • Enhance and rigorously execute on design methodologies and processes for PIC development.
  • Oversee the development and scaling of internal design tools to improve and automate PIC layout activities
  • Work with cross-functional teams to understand and define product requirements and plans
  • Independently resolves issues and conquer organization and technical challenges
  • Develop and actively manage project budgets, schedules, and risk profiles
  • Provide inputs into product road maps
Qualifications

MS/PhD in engineering, 10+ years’ experience in telecommunications, optoelectronics, or microelectronics development with significant time in management role
Significant experience with optical component design for performance, especially for InP devices
Familiarity with InP opto-electronic fabrication, material characterization and epitaxy knowledge experience with product development is highly desired.
The Job will require frequent collaborative interaction with fab, epitaxy, test and reliability engineering, packaging, product engineering, and system engineering groups
Strong leadership and communication and engineering and project management skills
Experienced in leading a diverse team of strong Individual contributors
Technical depth to understand concerns and communicate status and resolution to executive leadership team
Ability to evaluate candidates, mentor and develop the team 

NION2026 

Top Skills

Analog Asic Design
Inp Devices
Optoelectronic Packaging
Photonic Integrated Circuits

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