Sr. Photolithography Process Development Engineer

Position Summary

We are looking for a hardworking, passionate, and experienced Lithography Engineer to support our Florida Advanced Packaging site. In this role, you will be responsible for the development, optimization, integration, and continuous improvement of lithography processes used in advanced semiconductor packaging and MEMS/Photonic device manufacturing. The Lithography Engineer will work closely with process engineers, equipment engineers, integration teams, and foundry customers to develop robust, manufacturable lithography processes that meet critical dimension, overlay, defectivity, and patterning requirements. The ideal candidate will have strong semiconductor fab processing experience, excellent problem-solving skills, and the ability to use data-driven methods to improve process capability, yield, and device performance. Excellent oral and written communication skills are required to effectively communicate technical concepts, development results, and recommendations to customers, colleagues, and management.

Major Areas of Accountablility:

• Develop, optimize, transfer, and integrate lithography processes in a high-volume or advanced semiconductor manufacturing environment.
• Develop and qualify robust, manufacturable photoresist and patterning processes for advanced packaging, MEMS, and photonic device applications.
• Optimize lithography process conditions including resist coating, baking, exposure, development, descum, and associated process steps.
• Develop and optimize exposure recipes to achieve required critical dimensions, pattern fidelity, overlay, and process margins.
• Support process integration of lithography with deposition, etch, CMP, metallization, and dielectric processes.
• Develop and maintain lithography process specifications, operating windows, process recipes, and documentation.
• Utilize CD-SEM, optical metrology, profilometry, overlay metrology, defect inspection, and other characterization techniques to evaluate lithography performance.
• Conduct Design of Experiments (DOE) to identify key process parameters and establish robust operating windows.
• Analyze process data to identify sources of variation, process marginalities, and opportunities for continuous improvement.
• Monitor inline and end-of-line SPC charts for trends, excursions, and abnormal process behavior.
• Investigate lithography-related defects, patterning failures, CD variation, overlay errors, and yield losses using structured problem-solving methodologies.
• Partner with equipment and process engineers to troubleshoot lithography tool performance and improve equipment/process capability.
• Support new product introduction, customer-specific process development, and technology transfers into manufacturing.
• Collaborate with integration and device teams to understand lithography requirements and translate device designs into manufacturable process solutions.
• Monitor electrical test parametrics and correlate lithography process performance with downstream device and package performance.
• Develop process control strategies and recommend appropriate metrology and monitoring plans for lithography processes.
• Prepare technical reports, presentations, process documentation, and development summaries for customers, colleagues, and management.
• Participate in cross-functional problem-solving teams and lead lithography-related improvement projects.

Required Qualifications:

Education

• BS (1-2 plus years exp.) degree in Electrical Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, Physics, or a related engineering/scientific discipline.
• MS or PhD preferred (0-1 years exp.).

Experience and Skills

• Hands-on semiconductor fab processing experience with a strong understanding of lithography processes and equipment.
• Experience with conventional photolithography processes including resist coating, soft bake, exposure, post-exposure bake, development, and resist strip.
• Experience with a variety of lithography platforms and exposure technologies, including mask-based, direct-write, and maskless lithography.
• Understanding of lithography process parameters including critical dimension, overlay, focus, dose, resist thickness, pattern fidelity, resolution, defectivity, and process window.
• Experience developing and optimizing lithography processes for non-standard or complex patterning requirements, including high-aspect-ratio structures, fine features, large-area patterns, and customized customer designs.
• Experience with semiconductor patterning and integration, including interactions between lithography and etch, deposition, CMP, metallization, and dielectric processes.
• Experience with CD-SEM, optical microscopy, profilometry, overlay metrology, defect inspection, and other lithography characterization techniques.
• Knowledge of DOE, SPC, Six Sigma, statistical analysis, and process capability concepts and applications.
• Experience using data analysis and statistical techniques to identify process trends, root causes, process marginalities, and improvement opportunities.
• Strong understanding of semiconductor manufacturing, process control, and yield improvement methodologies.
• Clear problem-solving capability with a data-driven, inventive, and solution-oriented approach.
• Ability to articulate technical thought processes and communicate complex engineering concepts effectively.
• Ability to work independently while also contributing effectively within cross-functional teams.
• Strong written and verbal communication skills.
• U.S. Person Required: This position requires compliance with the International Traffic in Arms Regulations (ITAR). All accepted applicants must be U.S. Persons. ITAR defines a U.S. Person as U.S. citizen, U.S. Permanent Resident, Political Asylee, or Refugee.