SoC Digital Design Director

We are seeking a highly skilled and experienced Director of Digital Design Engineering to join our System-on-Chip (SoC) team. This leadership role demands a mix of technical expertise, hands-on contribution, and strong team management. The ideal candidate will play a critical role in driving the development of high-quality chiplets for Machine Learning (ML) and High-Performance Computing (HPC) applications.

This role is hybrid, based out of Toronto, Ottawa or Boston.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Responsibilities:

 • Lead and mentor a geographically distributed team of digital design engineers.

 • Be hands-on with RTL coding, focusing on improving quality and driving methodology advancements.

 • Architect and implement robust SoC designs, including CPU integration, security features, boot processes, and system interfaces.

 • Develop and verify designs using protocols such as PCIe, Ethernet, AXI, CHI, and various slow-speed serial interfaces.

 • Collaborate across team boundaries, working with hardware, firmware, and verification teams to ensure seamless integration and execution.

 • Establish and enhance design and verification methodologies to improve efficiency and quality.

 • Drive innovation and best practices in the design and development of chiplets for ML and HPC applications.

 • Ensure timely delivery of projects by managing schedules, resources, and risks effectively.

Experience & Qualifications:

 • Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.

 • 15+ years of experience in digital design engineering, with a focus on SoC development.

 • Proven track record of leading and mentoring engineering teams across multiple geographies.

 • Hands-on experience with RTL coding and methodologies for high-quality design.

 • Deep knowledge of SoC concepts, including CPU integration, security, boot, PCIe, Ethernet, AXI, CHI, and related protocols.

 • Familiarity with slow-speed serial interfaces and high-performance chiplet design.

 • Excellent problem-solving and communication skills, with a collaborative mindset.

 • Demonstrated ability to drive methodology improvements and foster innovation.

Preferred Qualifications:

 • Experience in ML or HPC applications.

 • Knowledge of chiplet architectures and die-to-die interfaces.

 • Strong understanding of verification methodologies and tools.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Due to U.S. Export Control laws and regulations, Tenstorrent is required to ensure compliance with licensing regulations when transferring technology to nationals of certain countries that have been licensing conditions set  by the U.S. government.

Our engineering positions and certain engineering support positions require access to information, systems, or technologies that are subject to U.S. Export Control laws and regulations, please note that citizenship/permanent residency, asylee and refugee information and/or documentation will be required and considered as Tenstorrent moves through the employment process.

If a U.S. export license is required, employment will not begin until a license with acceptable conditions is granted by the U.S. government.  If a U.S. export license with acceptable conditions is not granted by the U.S. government, then the offer of employment will be rescinded.