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HRL Laboratories

Electrical Engineer: RF Subsystems (PCB Specialist)

Posted 2 Days Ago
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Hybrid
Lost Hills, CA
146K-187K
Senior level
Hybrid
Lost Hills, CA
146K-187K
Senior level
Responsible for designing, implementing, and testing RF subsystems while mentoring junior engineers and collaborating with mechanical teams.
The summary above was generated by AI
Essential Job Functions:
Contribute technical expertise and work within a fast-paced team of scientists and engineers on the development of next generation RF/mmWave Subsystems.
Candidate will be expected to work within diverse teams taking responsibility for the design, implementation and test of high-performance electrical subsystems. 
Take responsibility for the design, implementation, and testing of high-performance RF subsystems.
Perform preliminary and critical designs using COTS or custom active and passive components with minimal oversight.
Oversee fabrication and testing processes, ensuring adherence to project timelines and quality standards.
Conduct schematic capture, PCB layout, fabrication documentation, and module assembly.
Collaborate with Mechanical Engineering to develop thermal solutions and address mechanical design considerations.
Mentorship of junior engineers, and responsibility for setting and encouraging development best practices.

Required Skills:
Extensive experience with Schematic Capture and PCB Layout
Minimum 8 years of experience in designing, implementing, and testing electronic circuits
Proficiency in simulating the behavior of electronics using software such as HFSS, ADS, or similar
Expertise in RF & mmW PCB development, layout, and testing
Experience with Altium Designer
Proven track record in the design and qualification of hardware for military applications
In-depth knowledge of electronic sub-assemblies from component to subsystem level, including operation, controls, and safety
Strong familiarity with the characteristics and trade-offs of today’s active and passive components, and the availability of COTS components
Advanced understanding of RF components and devices
Expertise in conventional and advanced microelectronic packaging/integration and thermal management
Proficiency with digital, mixed-signal, power, and signal integrity tools
Comprehensive knowledge of PCB manufacturing standards (IPC 6012, IPC-A-610, Drill tolerancing, etc.)
Proficiency in use of computers, engineering workstations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment. Ability to work well in a team and independently.

Required Education:
Bachelor’s Degree or equivalent; advanced degree preferred.

Physical Requirements:
Ability and willingness to travel 20% of time.

Special Requirements:
U.S. Citizenship. Ability to obtain and maintain a security clearance.

Compensation:
The base salary range for this full-time position is $145,745 - $186,688 + bonus + benefits.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.

We are proud to be an EEO/AA employer M/F/D/V. We maintain a drug-free workplace and perform pre-employment substance abuse testing. 

Top Skills

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Hfss
Pcb Layout

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