K2 Space Corporation Benefits Overview

Designs advanced ASIC packages, including FC-BGA and MCM architectures, from early trade studies through production. Responsibilities include substrate and ball-map definition, SI/PI and thermal design, high-speed signal breakout, material and assembly selection, vendor management, qualification, and collaboration with silicon, RF, and systems teams. The role focuses on high-pin-count, power-dense mixed-signal and digital SoC packages for high-reliability aerospace applications.

Lead end-to-end ASIC package architecture and execution for high-performance FC-BGA and MCM solutions. Own substrate stackups, ball maps, SI/PI, thermal design, material selection, vendor qualification, packaging standards, and production ramp. Partner with silicon, RF, and systems teams to optimize package interfaces and ensure reliable, first-pass success for high-pin-count, power-dense mixed-signal and digital ASICs.

Leads the architecture, circuit design, integration, verification, tapeout, and silicon validation of high-speed ADCs, DACs, and analog front-ends for advanced mixed-signal SoCs. The role covers converter trade studies, FinFET CMOS circuit implementation, calibration, clocking, references, signal integrity, and DSP collaboration. It also provides technical leadership, establishes design methodologies, and mentors analog and mixed-signal engineers.